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Publication
Cyber-physical production systems supported by intelligent devices (smartboxes) for industrial processes digitalization
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Advisor(s)
Abstract(s)
ndustry 4.0 paradigm is a reality in the digitization of industrial processes and physical assets, as well as their integration into digital ecosystems with several suppliers of the value chain. In particular, Industry 4.0 is the technological evolution of embedded systems applied to Cyber-Physical Systems (CPSs). With this, a shift from the current paradigm of centralization to a more decentralized production, supported by Industrial Internet of Things (IIoT), is implied. The work reported in this paper focuses on the development of smart devices (SmartBoxes), based on low-cost hardware such as Raspberry Pi and also platforms certified for industrial applications, such as NI CompactRIO. Both platforms adopted the OPC-UA architecture to collect data from the shop-floor and convert it into OPC-UA Data Access standard for further integration in the proposed CPPS. Tests were also performed with the MQTT protocol for monitorization. Each SmartBox is capable of real-time applications that run on OPC-UA and MQTT, allowing easy interaction between supervisory systems and physical assets.
Description
© © 2019 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.”
Keywords
Cyber-physical systems Internet of things Manufacturing system Production engineering computing Protocols
Pedagogical Context
Citation
TORRES P. [et al.] (2019) - Cyber-physical production systems supported by intelligent devices (smartboxes) for industrial processes digitalization. In International forum on Research and Technology for Society and Industry (RTSI), 5th, Florence . [S.L.]: IEEE, p. 73-78. Doi: 10.1109/RTSI.2019.8895553
Publisher
Institute of Electrical and Electronics Engineers